Dark pool activity was detected in FLEX stock on February 5, 2020.

The dark pool trades look like buy orders because of how FLEX stock responded to the prints by moving higher.

On January 30, 2020, Flex (NASDAQ: FLEX) announced results for its third quarter ended December 31, 2019. Flex reported Q3 adjusted EPS of 38c versus the consensus estimate of 34c. The company reports Q3 revenue of $6.46B versus the consensus estimate of $6.19B. The company said, “Our third quarter fiscal year 2020 performance resulted in record adjusted EPS, improved adjusted margins and greater adjusted free cash flow generation. These results validate our continued transition as we manage our portfolio mix, operate with disciplined execution, and pursue design-led manufacturing. There is still work to do, but our consistent performance over the last 3 quarters has positioned us well on the path to profitable growth.”

Flex said it remains committed to using share buybacks to enhance shareholder returns and repurchased approximately $61M and $173M of ordinary shares during the three-month and nine-month periods ended December 31, 2019.

On January 6, 2020, Flex (NASDAQ: FLEX), the global supply chain and manufacturing company, in collaboration with QuickLogic Corporation and Infineon Technologies AG, announced the availability of the FLEXino Sensor Fusion Development Kit to enable rapid prototyping and a corresponding 12mm x 12mm System-in-Package (SiP) for high volume production of Internet of Things (IoT) devices. To help reduce time to market and scale production, the development kit and SiP enable a wide range of new and existing sensor fusion IoT products requiring audio, pressure and motion sensing, Bluetooth and WiFi capabilities.

“The FLEXino Sensor Fusion Development Kit and SiP are designed to help bring a variety of next-generation and existing IoT devices to market faster,” said Dave Gonsiorowski, vice president, Innovation Services & Solutions at Flex. “A significant challenge with IoT design today is the availability of flexible integrated development kits that easily transition to high-volume manufacturing. We are proud to have collaborated with QuickLogic and Infineon and provide a solution that enables customers across several industries to design products at unprecedented speeds.”

“Flex and QuickLogic worked closely together to integrate our EOS S3 SoC ultra-low power voice and sensor processing platform with their FLEXino Sensor Fusion Development Kit and SiP,” said Brian Faith, chief executive officer of QuickLogic. “The development kit includes a sensor fusion daughter board featuring the EOS S3 SoC, and the SiP version miniaturizes the same functionality into a single package that can be used for volume production. By working with Flex and Infineon, we are able to deliver sensor fusion customers a complete and seamless development path.”

“The collaboration is another step by Infineon to make the products we use every day smarter using our advanced sensor and sensor fusion software technologies,” said Philipp Von Schierstaedt, vice president and general manager, Radio Frequency and Sensors at Infineon Technologies. “The development kit combined with Infineon’s digital sensors and microphones delivers seamless, effortless interactions between people and the next generation of IoT devices across multiple industries.”

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