March 9, 2017: NXP Semiconductors announced the world’s smallest single-chip SoC solution with the release of their MC9S08SUx microcontroller (MCU) family with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications. Extending the company’s S08 family of MCUs, the robust 8-bit MC9S08SUx microcontroller family offers 4.5V~18V supply voltage range with lower bill of materials (BOM) cost and tighter integration for higher performance and reliability. The new SoC units address the growing demand to replace multiple device solutions with a single MCU to reduce cost and system size, while simplifying integration and layout for space-constrained use cases.
January 7, 2017: NXP Semiconductors, the worlds leading provider of automotive electronics solutions, announced a long-term strategic partnership with Geely Automobile Group, a Chinese multinational automotive manufacturing company. The companies will work together on a new platform for research and development to connect innovation in semiconductor technology more efficiently with demand in the automobile industry. The efforts will support world-class, tailor-made solutions for Geely, and build the global competitiveness of Chinas automobile industry.
The initial phase of the partnership will focus on enhancing in-vehicle infotainment and telematics experiences through state-of-the-art automotive micro controllers, radio chips, secure car access, automotive networks and other applications.
Additional phases will include technical and R&D cooperation in the fields of advanced driver assistance systems (ADAS); intelligent interconnected vehicles or vehicle-to-everything (V2X); and automotive network security. This partnership is part of the global effort underway to transform cars from simply a mode of transportation to secure information hubs
December 19, 2016: NXP Semiconductors N.V. and Huawei, one of the worlds most popular manufacturers of smartphones, today announced they will extend their strategic collaboration that will result in more secure and convenient mobile payment experiences for public transit systems in Shanghai City, Shenzhen, Guangzhou, and Beijing.According to Huawei, mobile transit is a convenient feature with a growing demand by smartphone users. Huawei Honor smartphones are designed to combine security and connectivity to fit the growing digital lifestyle and mobile transit fits naturally into this dynamic evolution of convenience, security and simplicity in smartphones. Together with NXP, Huawei is happy and proud to deliver these capabilities to our users.This collaboration enables consumers to securely preload the fare into their Huawei Honor 8 or Honor V8 phone. Using Huawei Pay, consumers tap the phone to a reader to use the fare for boarding, top-up their account and more. Users will also benefit from NXPs proven secure mobile transit solution which features Near Field Communications (NFC) and embedded Secure Element (eSE) in the same module combined with NXPs ecosystem of experts and partnerships.
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The Finviz screener settings used to find NXP Semiconductors are: Forward P/E Low (<15), EPS growth this year Over 30%, EPS growth past 5 years Over 25%, EPS growth next 5 years High (>25%)
NXP Semiconductors N.V. creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing.